Beckhoff presents PC-based automation for packaging systems at Interpack 2026

Beckhoff Automation will present PC-based control technologies for packaging applications at Interpack 2026 from 7-13th May (Hall 11, Booth D26) in Düsseldorf, focusing on transport systems, modular automation architecture, and AI-supported engineering tools.

The portfolio addresses requirements for flexible machine design, reduced resource consumption, and shorter development cycles in packaging production.

Planar and linear transport systems for flexible product handling
The XPlanar system enables contactless product transport using planar motor technology. Movers float above a tile-based surface, allowing motion in six degrees of freedom with positioning precision in the micrometer range. Maximum speeds reach up to 3 m/s, supporting high-throughput applications.

This design eliminates mechanical wear and allows customized transport paths within compact machine layouts. Different tile configurations and mover geometries enable adaptation to specific packaging processes.

The XTS linear transport system complements this approach by enabling independent motion profiles for each carrier. This allows decoupling of process steps, improving throughput by preventing bottlenecks in slower operations. Software-based format changes can be implemented without stopping production.

Variants such as XTS Hygienic support applications in food and pharmaceutical environments, while No Cable Technology enables contactless power and data transmission to movers, allowing execution of additional processes such as weighing or alignment during transport.

Control cabinet-free automation architecture
The MX-System integrates control, I/O, and drive components into a modular, machine-mounted platform, eliminating the need for conventional control cabinets. This reduces wiring complexity and installation space while enabling scalable system configurations.

Modules can be connected through a plug-in architecture, allowing rapid replacement and simplified maintenance. Integrated diagnostics, including wireless access, support faster fault detection and reduced downtime.

A web-based configuration tool enables system design and evaluation during the planning phase, supporting engineering workflows.

Drive systems and motion integration
The presented drive portfolio includes servo drives, frequency inverters, and synchronous motors designed for packaging machine applications. The AX1000 servo drives support power ranges up to 1,700 W, while frequency drives cover outputs up to 5.5 kW.

Synchronous servomotors with single-cable connection technology simplify installation and reduce cabling requirements. Integration with the control platform enables coordinated motion control and diagnostic capabilities across the system.

Software architecture and AI integration
The automation platform is based on integrated software for control, motion, and system management. Enhancements in PLC runtime and motion control optimize CPU utilization and system performance.

AI-supported tools are used to assist in engineering and operation. Functions include code generation, system diagnostics, and data-driven model creation. Machine learning models can be trained using operational data and executed directly on the controller for real-time analysis.

Application in packaging machine development
The presented technologies support the development of packaging systems requiring high flexibility, rapid format changes, and efficient resource use. Integration of transport, control, and software functions enables modular machine architectures adaptable to varying production requirements.

The solutions from Beckhoff Automation demonstrate how PC-based control and integrated system design can improve efficiency and scalability in packaging automation.

Edited by Natania Lyngdoh, Induportals Editor — Adapted by AI.

www.beckhoff.com