Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.
Bread. Just thinking of the word pushes your olfactory senses to imagine yeast-based delights at the counter of your favorite bakery. But baking the perfect loaf, and in large enough quantities, demands furnaces that accurately control the process from beginning to end. This was precisely the task faced by Mechatronics Ltd., a system integrator and official distributor of Delta Motion, Drive, Control, and Robotics products based in Bulgaria.
For millennia, humans have endeavoured to artificially control growing environments to boost crop and plant growth. Today, the most common form of controlled environment agriculture (CEA) is the greenhouse.
ANDRITZ Inc., a member of international technology Group ANDRITZ, has been selected by Domtar Corporation to provide equipment and technical services for conversion of a power boiler and a recovery boiler at their Kingsport paper mill, in Kingsport, TN, USA.