Decentralized Automation Architecture for Packaging Machines

At interpack 2026 (4–10 May, Düsseldorf, Germany), Murrelektronik introduced a decentralized automation approach for packaging machines, focusing on modular architectures, digital installation tools, and integrated connectivity to support flexible and scalable production systems.

Modular machine design with decentralized intelligence
Packaging lines increasingly require rapid format changes, variable batch sizes, and compact machine layouts. Murrelektronik’s Vario-X system addresses these requirements through a decentralized automation architecture, where control intelligence is distributed closer to sensors and actuators.

The system uses a plug-in design that reduces cabinet space and enables modular expansion. This supports machine configurations adaptable to different cycle times and product variants. In a joint demonstration with ATS Corporation, the system was combined with a linear transport platform to create a plug & play conveyance solution, illustrating how decentralized control can reduce footprint while maintaining throughput.

Digital tools for installation and commissioning
To support complex machine setups, Murrelektronik introduced digital tools aimed at reducing commissioning effort. The uKonn-X platform provides guided installation workflows, enabling step-by-step configuration of automation components. This approach reduces wiring and configuration errors, particularly in distributed systems.

A digital machine twin complements this process by simulating system behavior before physical deployment. By validating configurations virtually, commissioning time can be reduced by up to 70%, particularly when transitioning from centralized control cabinets to decentralized field installations.

IO-Link integration in a digital supply chain
The pure.IO system extends connectivity by supporting IO-Link communication in daisy-chain topologies with up to 256 I/O points. It integrates power supply, fieldbus communication, and device-level connectivity within a single installation structure.

This architecture supports a digital supply chain in packaging production, where sensor-level data can be accessed and analyzed in real time. The result is improved transparency for condition monitoring, predictive maintenance, and process optimization across packaging and intralogistics systems.

Simplified machine vision integration
Machine vision is increasingly used for quality inspection and format verification. The One-Cam-Connect solution standardizes the integration of single-camera systems into packaging machines, reducing engineering effort for inspection tasks.

By simplifying connectivity and setup, the system enables faster deployment of vision-based quality control without requiring extensive customization.

Hybrid safety and communication architecture
The MVK Fusion CIP Safety module combines standard I/O, safety I/O, and IO-Link connectivity within a single device. It complies with the CIP Safety protocol used in Ethernet/IP networks, enabling integrated safety and control communication.

This hybrid approach reduces hardware complexity and wiring requirements while maintaining functional safety standards. Flexible cable configurations (4-, 5-, and 8-pin) support different installation scenarios in packaging environments.

Compact high-power connectivity
Power distribution in decentralized systems requires compact yet robust connectors. The MQ 15 connector system supports motors up to 7.5 kW and frequency converters, delivering high current capacity within limited installation space.

The connectors use a quick-connect mechanism to reduce installation time while maintaining IP67-rated protection, making them suitable for industrial environments with exposure to dust and moisture.

Application scope and industry relevance
The technologies presented target packaging machinery, intralogistics systems, and modular production lines where flexibility and rapid reconfiguration are critical. By combining decentralized control, IO-Link connectivity, and digital engineering tools, Murrelektronik’s approach aligns with broader industry trends toward modular automation and data-driven operations.

This integrated architecture enables machine builders and operators to reduce installation complexity, improve scalability, and enhance system transparency across the lifecycle of packaging equipment.

Edited by an industrial journalist Sucithra Mani with AI assistance.

www.murrelektronik.com