Fibre-Based Packaging for Electrical Switchgear Transport

DS Smith and Schneider Electric have collaborated to develop a fibre-based packaging solution for transporting integrated electrical switchgear products. Designed for industrial automation and manufacturing environments, the packaging combines product protection, automated handling compatibility and recyclable materials for heavy-duty applications.

Packaging design for industrial equipment
The cooperation brings together DS Smith's expertise in fibre-based packaging engineering and Schneider Electric's requirements for transporting integrated electrical switchgear. The project addresses the challenge of protecting heavy and mechanically complex equipment throughout production, logistics and distribution while supporting material efficiency and circular packaging practices.

The solution was developed as a universal design suitable for three different electrical switchgear configurations. Its structure enables secure fixation of moving components while maintaining compatibility with automated packaging operations.

Technical solution and partner responsibilities
DS Smith designed and validated the packaging architecture, while Schneider Electric defined the functional and operational requirements based on the characteristics of its switchgear products.

The packaging consists primarily of corrugated cardboard and multi-layered fibre-based endcaps that provide structural stability during transport. An openable side tray forms a stable base for handling and allows the equipment to be securely anchored before shipment.

Additional protective elements include a polyethylene bag that shields lubricated components from dust and folded corrugated cardboard inserts that isolate exposed metal connectors. Multiple corrugated layers are bonded together to increase mechanical strength while minimising unused internal space.

The packaging was also designed for integration into automated production lines. Because the switchgear products are transported using industrial manipulators that lift the equipment from the side, the packaging accommodates this handling method without compromising structural integrity.

Validation and implementation
As part of the engineering validation process, DS Smith conducted drop testing to evaluate resistance to impact, shock and structural damage during transportation. The compact packaging geometry reduces void space, contributing to lower material consumption and improved freight and storage efficiency.

Despite its multi-component construction, the packaging can be assembled in less than one minute on automated packaging lines with limited folding operations, supporting efficient industrial deployment.

Industrial applications
The packaging is intended for electrical switchgear used in industrial facilities, power distribution systems and other electrical infrastructure applications where large, integrated equipment requires secure transport and handling.

By combining recyclable fibre-based materials with packaging designed for automated manufacturing processes, the solution improves product protection, handling stability and operational efficiency while supporting Schneider Electric's broader packaging circularity objectives.

"The Electrical Switchgear is a complex industrial product, and it can be incredibly heavy and delicate to transport, and so achieving the correct balance between protection, handling efficiency, and sustainability, is absolutely key in a packaging solution. This design demonstrates what can be achieved with fibre-based and corrugated cardboard solutions. The intention was to make a solution that is not only robust, but fast and easy to assemble, and both sustainability and recyclability are extremely important factors for our customer." — Levente Szabó, Cluster Director, DS Smith Hungary

The packaging solution received recognition in the Electronics category at the 2026 WorldStar Global Packaging Awards, reflecting its engineering approach to protecting heavy industrial equipment while improving packaging efficiency.

Edited by Sucithra Mani, Induportals editor – adapted by AI.

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