On-site experts to present new Tetra Pak® A1 1100 Filling Machine, Direct UHT Unit, and Full Plant Solutions for enhanced efficiency and sustainable market impact.
Global technology, software and engineering leader Emerson will exhibit its latest Floor to CloudTM packaging solutions at PACK EXPO Chicago, November 3-6, 2024.
The trade fair presentation will focus on energy efficiency, IE5+ motor technology and decentralised drive electronics with new functional safety features.
Demonstrations covering multiple Bosch Rexroth automation technologies will be featured at PACK EXPO 2024, including a complete palletizing solution with a collaborative robots.
Hygiena introduces the Sampling Plan Module, a new innovation within the SureTrend platform, designed to streamline food safety management, improve traceability, simplify data management, and enhance collaboration.
Attendees will discover how the convergence of flexible equipment and cutting-edge digital solutions are enabling manufacturers to optimize and transform their operations.
From November 5 to 7, we will be at the 10th edition of the Gulfood Manufacturing 2024 trade fair, showcasing packaging solutions aimed at frozen fresh products and processed foods.